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DOI	10.1016/j.solener.2020.10.021
	Numerical analysis of the reliability of photovoltaic modules based on the fatigue life of the copper interconnects
	Aly, Shahzada Pamir; Ahzi, Said; Barth, Nicolas; Abdallah, Amir
通讯作者	Aly, SP (corresponding author), Hamad bin Khalifa Univ HBKU, Qatar Environm & Energy Res Inst QEERI, Qatar Fdn, POB 34110, Doha, Qatar.
来源期刊	SOLAR ENERGY
ISSN	0038-092X
EISSN	1471-1257
出版年	2020
卷号	212 页码:152-168
英文摘要	A typical photovoltaic (PV) module is composed of different layers bonded together, each with a different material and thus, a different coefficient of thermal expansion (CTE). While under operation, it is subjected to thermal loads due to continuous temperature variations. The CTE mismatch induces thermo-mechanical stresses, whose cyclic nature causes fatigue failure. Due to their relative small size, the copper interconnects are one of the most vulnerable constituents. In this work, the finite element (FE) analysis has been used to calculate these thermal stress/strain variations. To make the simulations more reliable, well-known material models have been adopted from the literature and used for each constituent of the PV module. Furthermore, to reduce computational time and complexity, a simplified modeling approach has been proposed in this work. In this approach, a 2-D FE global model was first used to identify the region that undergoes maximum strain. Then a 3-D FE local model was used for that particular region only. This approach helps calculate the maximum stress/strain variations. Thus, using the proposed modeling approach coupled with a fatigue criterion, one can calculate the fatigue life of the PV module, while significantly reducing the computational time. The initial conditions, in terms of residual stresses, due to the lamination process for the fabrications of the PV module are also accounted for in our approach. We applied our approach to silicon-based PV module under desert weather conditions of Doha (Qatar) and the results show a reduced life compared to the one provided by the manufacturer.
英文关键词	Photovoltaic module Finite element Material models Life prediction Fatigue life Copper interconnects
类型	Article
语种	英语
收录类别	SCI-E
WOS记录号	WOS:000597155600001
WOS关键词	RESIDUAL-STRESS ; SILICON ; BEHAVIOR ; MODEL ; TEMPERATURE ; SIMULATION
WOS类目	Energy & Fuels
WOS研究方向	Energy & Fuels
资源类型	期刊论文
条目标识符	http://119.78.100.177/qdio/handle/2XILL650/349189
作者单位	[Aly, Shahzada Pamir; Ahzi, Said; Barth, Nicolas; Abdallah, Amir] Hamad bin Khalifa Univ HBKU, Qatar Environm & Energy Res Inst QEERI, Qatar Fdn, POB 34110, Doha, Qatar
推荐引用方式 GB/T 7714	Aly, Shahzada Pamir,Ahzi, Said,Barth, Nicolas,et al. Numerical analysis of the reliability of photovoltaic modules based on the fatigue life of the copper interconnects[J],2020,212:152-168.
APA	Aly, Shahzada Pamir,Ahzi, Said,Barth, Nicolas,&Abdallah, Amir.(2020).Numerical analysis of the reliability of photovoltaic modules based on the fatigue life of the copper interconnects.SOLAR ENERGY,212,152-168.
MLA	Aly, Shahzada Pamir,et al."Numerical analysis of the reliability of photovoltaic modules based on the fatigue life of the copper interconnects".SOLAR ENERGY 212(2020):152-168.