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The mask composition checking flow is an evolution of the traditional mask rule check (MRC). In order to differentiate the flow from MRC, we call it Mask Data Correctness Check (MDCC). The mask house does MRC only to identify process limitations including writing, etching, metrology, etc. There still exist many potential errors that could occur when the frame, main circuit and dummies all together form a whole reticle. The MDCC flow combines the design rule check (DRC) and MRC concepts to adapt to the complex patterns in today's wafer production technologies. Although photomask data has unique characteristics, the MRC tool in Calibre R MDP can easily achieve mask composition by using the Extended MEBES job deck (EJB) format. In EJB format, we can customize the combination of any input layers in an IC design layout format, such as OASIS. Calibre MDP provides section-based processing for many standard verification rule format (SVRF) commands that support DRC-like checks on mask data. Integrating DRC-like checking with EJB for layer composition, we actually perform reticle-level DRC, which is the essence of MDCC. The flow also provides an early review environment before the photomask pattern files are available. Furthermore, to incorporate the MDCC in our production flow, runtime is one of the most important indexes we consider. When the MDCC is included in the tape-out flow, the runtime impact is very limited. Calibre, with its multi-threaded processes and good scalability, is the key to achieving acceptable runtime. In this paper, we present real case runtime data for 28nm and 14nm technology nodes, and prove the practicability of placing MDCC into mass production.