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Failure and Degradation Modes and Rates of PV Modules in a Hot-Dry Climate: Results after 16 years offield exposure | |
Yedidi, K.; Tatapudi, S.; Mallineni, J.; Knisely, B.; Kutiche, J.; TamizhMani, G. | |
通讯作者 | Yedidi, K. |
会议名称 | 40th IEEE Photovoltaic Specialists Conference (PVSC) |
会议日期 | JUN 08-13, 2014 |
会议地点 | Denver, CO |
英文摘要 | This study evaluates the frameless modules of same type (model B) in two 16-year old photovoltaic power (PV) systems to ascertain degradation rates, reliability failure modes and safety failure modes which occur in a hot-dry climate. Each system is composed of 1512 modules. The average degradation rate is determined to be 0.85%/year for the best modules and 1.1 %/year for all the modules (excluding the safety failed modules). Primary safety failure mode is the backsheet delamination though it is small (less than 1.7%). Primary degradation mode and reliability failure mode may potentially be attributed to encapsulant browning leading to transmittance/current loss and thermo-mechanical solder bond fatigue (cell-ribbon and ribbon-ribbon) leading to series resistance increase. Under the typical 20/20 warranty terms, 0.5-1.7% of the modules qualify for the safety returns, 73-76% of the modules qualify for the warranty claims and 24-26% of the modules are meeting the warranty terms. |
英文关键词 | reliability safety degradation O&M hot dry desert durability |
来源出版物 | 2014 IEEE 40TH PHOTOVOLTAIC SPECIALIST CONFERENCE (PVSC) |
出版年 | 2014 |
页码 | 3245-3247 |
EISBN | 978-1-4799-4398-2 |
出版者 | IEEE |
类型 | Proceedings Paper |
语种 | 英语 |
国家 | USA |
收录类别 | CPCI-S |
WOS记录号 | WOS:000366638903111 |
WOS类目 | Energy & Fuels ; Engineering, Electrical & Electronic |
WOS研究方向 | Energy & Fuels ; Engineering |
资源类型 | 会议论文 |
条目标识符 | http://119.78.100.177/qdio/handle/2XILL650/302931 |
作者单位 | Arizona State Univ, PRL, Tempe, AZ 85287 USA |
推荐引用方式 GB/T 7714 | Yedidi, K.,Tatapudi, S.,Mallineni, J.,et al. Failure and Degradation Modes and Rates of PV Modules in a Hot-Dry Climate: Results after 16 years offield exposure[C]:IEEE,2014:3245-3247. |
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