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DOI10.1109/MCSoC.2014.36
Adaptive Error- and Traffic-aware Router Architecture for 3D Network-on-Chip Systems
Ben Ahmed, Akram; Meyer, Michael; Okuyama, Yuichi; Ben Abdallah, Abderazek
通讯作者Ben Ahmed, Akram
会议名称8th IEEE International Symposium on Embedded Multicore/Manycore Systems-on-Chip (MCSoC)
会议日期SEP 23-25, 2014
会议地点Aizu Wakamatsu, JAPAN
英文摘要

The advent of deep sub-micron and 3D integration technologies has exacerbated reliability issues in packet-switched on-chip interconnection networks. A lot of researches have been conducted in order to make these systems immune to any short-term malfunction or permanent physical damage while minimizing the performance degradation as much as possible. In this paper, we present an adaptive Error-, and Traffic-aware 3D-NoC router architecture, called 3D-Fault-Tolerant-OASIS (3D-FTO) 1. 3D-FTO manages to avoid the system failure at the presence of a large number of faults and addresses the fault occurrence in links, input-buffers, and the crossbar, where the faults are more often to happen. The proposed 3D-FTO system was synthesized using Synopsis Design Compiler at 45nm CMOS process technology. Evaluation results show that our 3D-FTO is able to work around different kinds of faults ensuring graceful performance degradation while minimizing the additional hardware complexity and remaining power-efficient.


英文关键词3D NoC Error-aware Traffic-aware Adaptive
来源出版物2014 IEEE 8TH INTERNATIONAL SYMPOSIUM ON EMBEDDED MULTICORE/MANYCORE SOCS (MCSOC)
出版年2014
页码197-204
EISBN978-1-4799-4305-0
出版者IEEE
类型Proceedings Paper
语种英语
国家Japan
收录类别CPCI-S
WOS记录号WOS:000357812800027
WOS关键词ALGORITHM
WOS类目Computer Science, Theory & Methods ; Engineering, Electrical & Electronic
WOS研究方向Computer Science ; Engineering
资源类型会议论文
条目标识符http://119.78.100.177/qdio/handle/2XILL650/302897
作者单位Univ Aizu, Grad Sch Comp Sci & Engn, Aizu Wakamatsu, Fukushima 9658580, Japan
推荐引用方式
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Ben Ahmed, Akram,Meyer, Michael,Okuyama, Yuichi,et al. Adaptive Error- and Traffic-aware Router Architecture for 3D Network-on-Chip Systems[C]:IEEE,2014:197-204.
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