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DPWSim: A Simulation Toolkit for IoT Applications using Devices Profile for Web Services
Han, Son N.1; Lee, Gyu Myoung1; Crespi, Noel1; Nguyen Van Luong2; Heo, Kyongwoo3; Brut, Mihaela4; Gatellier, Patrick4
通讯作者Han, Son N.
会议名称1st IEEE World Forum on Internet of Things (WF-IoT)
会议日期MAR 06-08, 2014
会议地点Seoul, SOUTH KOREA
英文摘要

The OASIS standard Devices Profile for Web Services (DPWS) enables the use of Web services on smart and resource-constrained devices, which are the cornerstones of the Internet of Things (IoT). DPWS sees a perspective of being able to build service-oriented and event-driven IoT applications on top of these devices with secure Web service capabilities and a seamless integration into existing World Wide Web infrastructure. We introduce DPWSim, a simulation toolkit to support the development of such applications. DPWSim allows developers to prototype, develop, and test IoT applications using the DPWS technology without the presence of physical devices. It also can be used for the collaboration between manufacturers, developers, and designers during the new product development process.


英文关键词Internet of Things DPWS Web Service Simulation
来源出版物2014 IEEE WORLD FORUM ON INTERNET OF THINGS (WF-IOT)
出版年2014
页码544-547
EISBN978-1-4799-3459-1
出版者IEEE
类型Proceedings Paper
语种英语
国家France;South Korea
收录类别CPCI-S
WOS记录号WOS:000340717500121
WOS类目Computer Science, Hardware & Architecture ; Computer Science, Information Systems
WOS研究方向Computer Science
资源类型会议论文
条目标识符http://119.78.100.177/qdio/handle/2XILL650/302462
作者单位1.Telecom SudParis, Inst Mines Telecom, Dept Wireless Networks & Multimedia Serv, F-91011 Evry, France;
2.Telecom SudParis, Inst Mines Telecom, Dept Software Networks, F-91011 Evry, France;
3.Univ Sci & Technol, Elect & Telecommun Res Inst, Daejeon 305700, South Korea;
4.Thales Serv SA, Smart Syst Lab Theresis, F-91767 Palaiseau, France
推荐引用方式
GB/T 7714
Han, Son N.,Lee, Gyu Myoung,Crespi, Noel,et al. DPWSim: A Simulation Toolkit for IoT Applications using Devices Profile for Web Services[C]:IEEE,2014:544-547.
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