Knowledge Resource Center for Ecological Environment in Arid Area
DOI | 10.1115/1.2818760 |
Latent heat fluxes through soft materials with microtruss architectures | |
Traum, Matthew J.1,2; Griffith, Peter2; Thomas, Edwin L.1,3; Peters, William A.1 | |
通讯作者 | Peters, William A. |
会议名称 | ASME Energy Nanotechnology International Conference (ENIC 2006) |
会议日期 | JUN 26-28, 2006 |
会议地点 | Boston, MA |
英文摘要 | Microscale truss architectures provide high mechanical strength, light weight, and open porosity in polymer sheets. Liquid evaporation and transport of the resulting vapor through truss voids cool nearby surfaces. Thus, microtruss materials can simultaneously prevent mechanical and thermal damage. Assessment of promise requires quantitative understanding of vapor transport through microtruss pores for realistic heat loads and latent heat carriers. Pore size may complicate exegesis owing to vapor rarefaction or surface interactions. This paper quantifies the nonboiling evaporative cooling of a flat surface by water vapor transport through two different hydrophobic polymer membranes, 112-119 mu m (or 113-123 mu m) thick, with microtruss-like architectures, i.e., straight-through pores of average diameter of 1.0-1.4 mu m (or 12.6-14.2 mu m) and average overall porosity of 7.6% (or 9.9%). The surface, heated at 1350 +/- 20 W(t)/m(2) to mimic human thermal load in a desert (daytime solar plus metabolic), was the bottom. of a 3.1 cm inside diameter 24.9 cm(3) cylindrical aluminum chamber capped by the membrane. Steady-state rates of water vapor transport through the membrane pores to ambient were measured by continuously weighing the evaporation chamber The water vapor concentration at the membrane exit was maintained near zero by a cross flow of dry nitrogen (velocity = 2.8 m/s). Each truss material enabled 13-14 degrees C evaporative cooling of the surface, roughly 40% of the maximum evaporative cooling attainable, i.e., with an un-capped chamber Intrinsic pore diffusion coefficients for dilute water vapor (< 10.4 mole %) in air (P total similar to 112,000 Pa) were deduced from the measured vapor fluxes by mathematically disaggregating the substantial mass transfer resistances of the boundary layers (similar to 50 %) and correcting for radial variations in upstream water vapor concentration. The diffusion coefficients for the 1.0-1.4 mu m pores (Knudsen number similar to 0.1) agree with literature for the water vapor-air mutual diffusion coefficient to within 20%, but for the nominally 12.6-14.2 mu m pores (Kn similar to 0.01), the diffusion coefficient values were smaller, possibly because considerable pore area resides in noncircular i.e., narrow, wedge-shaped cross sections that impede diffusion owing to enhanced rarefaction. The present data, parameters, and mathematical models support the design and analysis of microtruss materials for thermal or simultaneous thermal-and-mechanical protection of microelectromechanical systems, nanoscale components, humans, and other macrosystems. |
英文关键词 | microtruss architecture latent heat transfer mass transfer pore diffusion MEMS nanotechnology membrane polymers soft materials evaporation nonboiling evaporative cooling phase change surface interface thermal management systems integration |
来源出版物 | JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME |
ISSN | 0022-1481 |
出版年 | 2008 |
卷号 | 130 |
期号 | 4 |
出版者 | ASME-AMER SOC MECHANICAL ENG |
类型 | Article;Proceedings Paper |
语种 | 英语 |
国家 | USA |
收录类别 | SCI-E ; CPCI-S |
WOS记录号 | WOS:000255110800004 |
WOS关键词 | POROUS MEMBRANES ; TRANSPORT ; MASS ; LITHOGRAPHY ; EVAPORATION ; HYDROGEN ; BEHAVIOR |
WOS类目 | Thermodynamics ; Engineering, Mechanical |
WOS研究方向 | Thermodynamics ; Engineering |
资源类型 | 会议论文 |
条目标识符 | http://119.78.100.177/qdio/handle/2XILL650/297214 |
作者单位 | 1.MIT, Inst Soldier Nanotechnol, Cambridge, MA 02139 USA; 2.MIT, Dept Mech Engn, Cambridge, MA 02139 USA; 3.MIT, Dept Mat Sci & Engn, Cambridge, MA 02139 USA |
推荐引用方式 GB/T 7714 | Traum, Matthew J.,Griffith, Peter,Thomas, Edwin L.,et al. Latent heat fluxes through soft materials with microtruss architectures[C]:ASME-AMER SOC MECHANICAL ENG,2008. |
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