干旱区生态环境知识资源中心(Arid): Surfactant selection for AM clean in a single wafer Oasis Wet System

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DOI	10.4028/www.scientific.net/SSP.92.57
	Surfactant selection for AM clean in a single wafer Oasis Wet System
	Baker, J; Beaudry, C; Morinaga, H; Verhaverbeke, S
通讯作者	Baker, J
会议名称	5th International Symposium on Ultra Clean Processing of Silicon Surfaces
会议日期	SEP 16-18, 2002
会议地点	OOSTENDE, BELGIUM
英文摘要	In this work we have investigated several types of surfactants and their ability to enhance the particle removal capability of a modified SC-1 only clean in an Oasis Wet System. Although there are several types of surfactants, we narrowed it down and called them Surfactant1, 2, and 3. These surfactants have the desirable properties needed for use in a semiconductor fab. They rinse easily leaving little residue, they are low foaming, and they have enhanced removal rates over typical SC-1.
英文关键词	surfactant RCA single wafer Oasis and SC-1
来源出版物	ULTRA CLEAN PROCESSING OF SILICON SURFACES V
ISSN	1012-0394
出版年	2003
卷号	92
页码	57-61
ISBN	3-908450-78-0
出版者	TRANS TECH PUBLICATIONS LTD
类型	Article;Proceedings Paper
语种	英语
国家	USA
收录类别	CPCI-S ; SCI-E
WOS记录号	WOS:000183458700014
WOS类目	Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
WOS研究方向	Materials Science ; Physics
资源类型	会议论文
条目标识符	http://119.78.100.177/qdio/handle/2XILL650/294683
作者单位	(1)Appl Mat Inc, Santa Clara, CA 95054 USA
推荐引用方式 GB/T 7714	Baker, J,Beaudry, C,Morinaga, H,et al. Surfactant selection for AM clean in a single wafer Oasis Wet System[C]:TRANS TECH PUBLICATIONS LTD,2003:57-61.