干旱区生态环境知识资源中心(Arid): Use of Melt Flow Rate Test in Reliability Study of Thermoplastic Encapsulation Materials in Photovoltaic Modules

Arid

DOI	10.2172/1027154
报告编号	NREL/TP-5200-52586
来源ID	OSTI_ID: 1027154
	Use of Melt Flow Rate Test in Reliability Study of Thermoplastic Encapsulation Materials in Photovoltaic Modules
	Moseley, J.; Miller, D.; Shah, Q.-U.-A. S. J.; Sakurai, K.; Kempe, M.; Tamizhmani, G.; Kurtz, S.
英文摘要	Use of thermoplastic materials as encapsulants in photovoltaic (PV) modules presents a potential concern in terms of high temperature creep, which should be evaluated before thermoplastics are qualified for use in the field. Historically, the issue of creep has been avoided by using thermosetting polymers as encapsulants, such as crosslinked ethylene-co-vinyl acetate (EVA). Because they lack crosslinked networks, however, thermoplastics may be subject to phase transitions and visco-elastic flow at the temperatures and mechanical stresses encountered by modules in the field, creating the potential for a number of reliability and safety issues. Thermoplastic materials investigated in this study include PV-grade uncured-EVA (without curing agents and therefore not crosslinked); polyvinyl butyral (PVB); thermoplastic polyurethane (TPU); and three polyolefins (PO), which have been proposed for use as PV encapsulation. Two approaches were used to evaluate the performance of these materials as encapsulants: module-level testing and a material-level testing.
出版年	2011
报告类型	Technical Report
语种	英语
国家	美国
来源学科分类	14 SOLAR ENERGY ; 36 MATERIALS SCIENCE ; ACETATES ; CREEP ; CURING ; ENCAPSULATION ; FLOW RATE ; PERFORMANCE ; POLYMERS ; POLYOLEFINS ; POLYURETHANES ; POLYVINYLS ; RELIABILITY ; SAFETY ; STRESSES ; TESTING ; THERMOPLASTICS CREEP ; VISCO-ELASTIC FLOW ; DURABILITY ; RELIABILITY ; PV ; ENCAPSULANTS ; Solar Energy - Photovoltaics
URL	http://www.osti.gov/scitech/servlets/purl/1027154
资源类型	科技报告
条目标识符	http://119.78.100.177/qdio/handle/2XILL650/270342
推荐引用方式 GB/T 7714	Moseley, J.,Miller, D.,Shah, Q.-U.-A. S. J.,et al. Use of Melt Flow Rate Test in Reliability Study of Thermoplastic Encapsulation Materials in Photovoltaic Modules,2011.