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Aqueous based single wafer Cu/low-k cleaning process characterization and integration into dual damascene process flow 期刊论文
发表期刊: ULTRA CLEAN PROCESSING OF SILICON SURFACES VII. 出版年: 2005, 页码: 353-356
作者:  Tang, JS;  Brown, BJ;  Verhaverbeke, S;  Chen, HW;  Papanu, J;  Hung, R;  Cai, C;  Yost, D
收藏  |  浏览/下载：8/0  |  提交时间：2019/11/28
single wafer clean  electromigration  Cu/low-k  
Aqueous based single wafer Cu/low-k cleaning process characterization and integration into dual damascene process flow 会议论文
会议名称: 7th International Symposium on Ultra Clean Processing of Silicon Surfaces. 会议地点: Brussels, BELGIUM. 会议日期: SEP 20-22, 2004
作者:  Tang, JS;  Brown, BJ;  Verhaverbeke, S;  Chen, HW;  Papanu, J;  Hung, R;  Cai, C;  Yost, D
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/07
single wafer clean  electromigration  Cu/low-k