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Diagnostic-driven yield engineering under atypical wafer foundry conditions 期刊论文
发表期刊: MICROELECTRONICS RELIABILITY. 出版年: 2021, 卷号: 119
作者:  Ngow, Y. T.;  Goh, S. H.
收藏  |  浏览/下载:3/0  |  提交时间:2021/07/30
Root Cause Deconvolution (RCD)  Tessent Yield Insight (TYI)  Set of unique  Graphic Database System (GDS)  Open Artwork System Interchange Standard (OASIS)  Scan diagnosis  User-Defined Online Search (UDOS)  KDB (conversion of GDS information in to Avalon database)  Synopsys Avalon